| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a highly reliable and new functional light-emitting device, on which a GaN-based light-emitting element is fitted in the form of flip chip. <P>SOLUTION: A light-transmissive base having a GaN-based semiconductor light-emitting element fixed thereon with an adhesive is fitted to lead frames in the form flip-chip. Light from the light-emitting element is emitted outside through a substrate of the element, the adhesive, the light-transmissive base containing a phosphor, and a sealing resin in this order. With this arrangement, the sealing resin in the direction of light emission is protected against color change which otherwise occurs due to the heat generated from the light-emitting element, thereby making the light-emitting device highly reliable. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
