| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for improving a curing rate of a conductive composition, a resistant composition and an anisotropic conductive composition for an electronic device, and to provide a composition suitable for a use in which the composition is quickly cured. <P>SOLUTION: The composition contains a specific polymer resin, a conductive filler, one or more near infrared-absorbing additives and optionally other additives such as either one of or both of an oxygen scavenger and a corrosion inhibitor, a reactive or non-reactive diluent, an inert filler and a non-reactive adhesion promoter. It is possible to improve the curing rate of the composition by exposing the composition to near infrared radiation source. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
