| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a circuit board which is free of distortions and deformations and has cavities on both surfaces, and to provide a manufacturing method for an electronic component having an internal cavity. <P>SOLUTION: The manufacturing method is disclosed for a laminated type circuit board or electronic component having cavities or cavity parts. The method comprises a process of manufacturing a plurality of ceramic green sheets patterned to form the cavities, or cavity parts of the laminated type circuit board or electronic component after at least an insulator, a conductor, and a lost material have been laminated; a process of laminating the ceramic green sheets so that lost materials are disposed at positions corresponding to the cavities or cavity parts; and a process of losing the lost material by subjecting the laminated body of the ceramic green sheets to a specific treatment to form the cavities or cavity parts. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
