| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce the resonance frequency of a structure by reducing the bonding area of bond and also enable to wire bond easily in the angular velocity detection device laminated with the angular velocity detection elements through the bond provided with a vibrator on a substrate for detecting the acceleration around the axis perpendicular to the substrate. <P>SOLUTION: The angular velocity detection device S1 is provided with: the vibrator body capable of vibrating in the horizontal surface of the substrate 10 on the substrate 10; and the angular velocity detection element 100 for detecting the acceleration around the vertical axis to the substrate 10 on the basis of the vibration of the vibrating body, which is laminated on the circuit substrate 200 through the bond 300. The upper surface of the substrate 10 of the angular velocity detection element 100 and the circuit substrate 200 are wire connected with the bonding wire 70, and the bond 300 is partially arranged under the connection part of the bonding wire 70 on the substrate 10 of the angular velocity detection element 100. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
