| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device, in which the dead space of a packaging area mounting the semiconductor device is reduced, as much as possible, a slit hole is formed correctly in order to miniaturize a packaging substrate using a dicing equipment having an infrared function, a lead terminal linked to an external electrode and a protective sealing mould can be dispensed by dividing a semiconductor substrate into predetermined size, and the appearance size is reduced markedly. <P>SOLUTION: A wire is provided on a first semiconductor chip 100, when the first semiconductor chip 100 and a second semiconductor chip 60 are mounted. The wire extends from a part right under the second semiconductor chip 60 to the circumference. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
