| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for efficiently manufacturing a submount chip applied sheet to which a plurality of submount chips are applied with a substantially continuous surface forming one end surface of a substrate and one end surface of a solder pattern. SOLUTION: A metallic layer formed as an element bonding electrode is formed on the surface of a substrate, a submount chip material substrate is prepared as an insulating substrate having a plurality of solder patterns arranged and formed on the metallic layer, and a glass plate is bonded to one surface of the submount chip material substrate having the solder patterns. Thereafter, parts of the glass plate, the solder patterns, the metallic layer, and the insulating substrate are sequentially ground to form a cut guide groove; and then the glass plate is removed. Next, an adhesive sheet is applied to one surface of the obtained substrate having the solder patterns and to the opposing surface of the substrate, and then the substrate is cut into submount chips without fully cutting the adhesive sheet. COPYRIGHT: (C)2006,JPO&NCIPI
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