| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for cleaving a semiconductor wafer that maintains wafer strength, is reduced in investment and manufactures OFs at a high yield, with fine cleavage surfaces, and with high cleavage profile irregularity, and to provide its associated cleavage jig. SOLUTION: This method employs a pillar-shaped cleavage jig 3 which integrates a groove 4 and a retainer 5. The groove 4 contains at least one groove 4a or 4b which can be engaged in a position of the semiconductor wafer 1 between a temporary orientation flat 1a formed on the semiconductor wafer 1 and a flaw 2 formed in almost parallel to the temporary orientation flat 1a. Then, the cleavage jig 3 is rotated with the portion of the semiconductor wafer 1 set in the cleavage jig 3 around the shaft parallel to the temporary orientation flat 1a, so that the semiconductor wafer 1 can be cleaved by using the flaw 2 as a point of origin, resulting in orientation flat formation. COPYRIGHT: (C)2006,JPO&NCIPI
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