| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board having good cooling property of a circuit element in which packaging constraints by the side of a board backside and interface with other component and further time and effort on manufacture do not become a problem in relation with the circuit board having the substrate and a circuit element packaged on the board. SOLUTION: The circuit board includes the board 20 in which one pair of pads 21 and 23 are formed in the positions corresponding mutually to surface and backsides 20a and 20b, the circuit element 10 having a heatsink 13 in which the solder connection of the heat dissipation part 13 to the one pad 21 of the pair of the pads 21 and 23, and a heat conductor 40 in which the substrate 20 is penetrated in the thickness direction and both the ends are respectively solder connected to the pair of the pads 21 and 23. The heat conductor 40 has a solid structure which prevents the penetration of air between the surface and backsides 20a and 20b at least at the part. COPYRIGHT: (C)2006,JPO&NCIPI
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