IMAGE SURFACE MEASUREMENT METHOD, EXPOSURE METHOD, DEVICE MANUFACTURING METHOD, AND EXPOSURE DEVICE

摘要

A main control device (50) moves a reticle stage (RST) in a scan direction, irradiates the area including a mark area where a predetermined mark is formed on the reticle (R) with illumination light (IL) so as to form at least one mark spatial image existing in the mark area via a projection optical system (PL) and measure the spatial image by using a spatial image measurement device (59). Such a measurement of a spatial image is repeatedly performed by the main control device while moving the reticle stage in the scan direction. According to the measurement result of the spatial image of each of the marks for each movement position, the main control device calculates a scan image surface where an image of patter formed on the reticle is formed by the projection optical system. According to the calculation result, the main control device performs focus leveling control of the wafer being subjected to scan exposure. Thus, it is possible to realize a highly accurate exposure without using a sensor for measuring the reticle (mask) position.