| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling device which can change the cooling performance according to a temperature change of a thermal head. SOLUTION: The cooling device 6 fitted at the thermal head 5 consists of a fixing member 31, a plurality of laminated type piezoelectric elements 32 and a heat sink 33. The laminated type piezoelectric element 32 has one end face in a lamination direction fixed to the fixing member 31, and the other end face fixed to the heat sink 33. A system controller controls a driving voltage applied to the plurality of laminated type piezoelectric elements 32 through a driving circuit, whereby the heat sink 33 shifts between a contact position where it comes in contact with an aluminum substrate 28 and a retreat position where it retreats from the contact position. COPYRIGHT: (C)2006,JPO&NCIPI
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