| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor laser device having a metal body for jointing DLC layer coated copper members, for preventing corrosion in the vicinity of the jointed regions, and for efficiently cooling the semiconductor laser element. SOLUTION: The semiconductor laser device 1 comprises a metal body 21, formed by bonding a plurality of copper members 21a, 21b, and 21c and provided with a passage for fluid 30 within; adhesive agents 70b and 70c in presence between the copper members 21a, 21b, and 21c; diamond-like carbon layers 40a, 40b, and 40c continuously coating the surfaces of the copper members 21a, 21b, and 21c, with the exception of exposed regions 50a and 50c located on the metal body 21; and a semiconductor laser element 80 arranged on the exposed region 50c. COPYRIGHT: (C)2006,JPO&NCIPI
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