Bonding configuration structure for facilitating electrical testing in a bonding process and a testing method using the same

摘要

A bonding configuration structure for facilitating electrical testing in a bonding process and a testing method are provided. The bonding configuration includes a bonded component, a bonding component, a bond portion and a leading component. The bonding component is disposed on the bonded component. The bonding component has a first end and a second end. The first end is coupled to the bond portion. The second end is disposed on the bonded component to form the first testing portion.