发明名称 |
SUBSTRATE HEATING EQUIPMENT SUBSTRATE HEATING METHOD |
摘要 |
<p>Substrate heating equipment performs heat treatment after exposure but prior to development to a substrate having a chemical-amplification resist film. The substrate heating equipment is provided with a placing table whereupon the substrate is placed substantially horizontal, with the resist film on top, a fluid supplying mechanism for supplying the substrate with glycerin, and a heating mechanism for heating the substrate on the placing table under the condition where the glycerin is brought into contact with the resist film. In the substrate heating equipment, the substrate on the placing table is heated under the condition where the glycerin is brought into contact with the resist film.</p> |
申请公布号 |
WO2006009045(A1) |
申请公布日期 |
2006.01.26 |
申请号 |
WO2005JP12956 |
申请日期 |
2005.07.13 |
申请人 |
TOKYO ELECTRON LIMITED;OCTEC INC.;NISHI, TAKANORI;KITANO, TAKAHIRO;OKUMURA, KATSUYA |
发明人 |
NISHI, TAKANORI;KITANO, TAKAHIRO;OKUMURA, KATSUYA |
分类号 |
H01L21/027;G03F7/039;G03F7/38 |
主分类号 |
H01L21/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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