发明名称 SUBSTRATE HEATING EQUIPMENT SUBSTRATE HEATING METHOD
摘要 <p>Substrate heating equipment performs heat treatment after exposure but prior to development to a substrate having a chemical-amplification resist film. The substrate heating equipment is provided with a placing table whereupon the substrate is placed substantially horizontal, with the resist film on top, a fluid supplying mechanism for supplying the substrate with glycerin, and a heating mechanism for heating the substrate on the placing table under the condition where the glycerin is brought into contact with the resist film. In the substrate heating equipment, the substrate on the placing table is heated under the condition where the glycerin is brought into contact with the resist film.</p>
申请公布号 WO2006009045(A1) 申请公布日期 2006.01.26
申请号 WO2005JP12956 申请日期 2005.07.13
申请人 TOKYO ELECTRON LIMITED;OCTEC INC.;NISHI, TAKANORI;KITANO, TAKAHIRO;OKUMURA, KATSUYA 发明人 NISHI, TAKANORI;KITANO, TAKAHIRO;OKUMURA, KATSUYA
分类号 H01L21/027;G03F7/039;G03F7/38 主分类号 H01L21/027
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