| 摘要 |
PROBLEM TO BE SOLVED: To provide a mold release laminated film excellent in heat resistance, chemical resistance, hydrolysis resistance and mold releasability, having flexibility and cushioning properties following the stepped parts of the circuit of a circuit board, excellent in press workability, not containing a substance which is bled out of a mold release material to stain the circuit board and optimum to a circuit board manufacturing process using a press. SOLUTION: The mold release laminated film is formed by laminating biaxially stretched films (layers A), which comprises a resin composition based on polyphenylene sulfide, on both sides of a resin composition layer (layer B) with a thermal deformation temperature of 70-150°C and constituted so that the ratio of the thickness of the layers A [thickness of layers A/(thickness of layers A + thickness of layer B)] to the whole thickness of the laminated film becomes 0.05-0.5. COPYRIGHT: (C)2006,JPO&NCIPI
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