| 摘要 |
PROBLEM TO BE SOLVED: To provide a beveling method that can prevent chipping arising on or near the crossed line of the rear and side of a GaP wafer in a beveling process and reduces GaP wafer cracks in the beveling process and the subsequent. SOLUTION: In a groove whose section comprises an arcuate bottom of curvature radius (R) and a side continuously joining with the corresponding bottom and opening with a slant of 10 to 30°to a surface perpendicular to a rotation shaft, a diamond grinding wheel formed all around the radial surrounding is used to control a clearance (t1) between the rear of the GaP wafer (6) and the area perpendicular to the rotation shaft of the diamond grinding wheel and passing the center of an arc at the bottom of the groove in such a way that the relation of 10°≤90°-sin<SP>-1</SP>(t1/R)≤55°is met. COPYRIGHT: (C)2006,JPO&NCIPI
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