发明名称 |
DEVELOPMENT PROCESSING DEVICE AND DEVELOPMENT PROCESSING METHOD |
摘要 |
<p>A development processing device has a substrate holding section for holding a substrate, a heater installed at the substrate holding section and heating on the substrate holding section the substrate in order to subject a resist film to PEB processing, a cooler for cooling on the substrate holding section the substrate, a development liquid nozzle for supplying on the substrate holding section a development liquid to the substrate, and a controller for individually controlling the heater, cooler, and development liquid nozzle.</p> |
申请公布号 |
WO2006009046(A1) |
申请公布日期 |
2006.01.26 |
申请号 |
WO2005JP12957 |
申请日期 |
2005.07.13 |
申请人 |
TOKYO ELECTRON LIMITED;OCTEC INC.;NISHI, TAKANORI;KITANO, TAKAHIRO;OKUMURA, KATSUYA |
发明人 |
NISHI, TAKANORI;KITANO, TAKAHIRO;OKUMURA, KATSUYA |
分类号 |
H01L21/027;G03F7/30;G03F7/38 |
主分类号 |
H01L21/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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