发明名称 DEVELOPMENT PROCESSING DEVICE AND DEVELOPMENT PROCESSING METHOD
摘要 <p>A development processing device has a substrate holding section for holding a substrate, a heater installed at the substrate holding section and heating on the substrate holding section the substrate in order to subject a resist film to PEB processing, a cooler for cooling on the substrate holding section the substrate, a development liquid nozzle for supplying on the substrate holding section a development liquid to the substrate, and a controller for individually controlling the heater, cooler, and development liquid nozzle.</p>
申请公布号 WO2006009046(A1) 申请公布日期 2006.01.26
申请号 WO2005JP12957 申请日期 2005.07.13
申请人 TOKYO ELECTRON LIMITED;OCTEC INC.;NISHI, TAKANORI;KITANO, TAKAHIRO;OKUMURA, KATSUYA 发明人 NISHI, TAKANORI;KITANO, TAKAHIRO;OKUMURA, KATSUYA
分类号 H01L21/027;G03F7/30;G03F7/38 主分类号 H01L21/027
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