Method for manufacturing BGA package using Organic Solderability Preservatives,申请号KR20040052227-传众专利搜索

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发明名称	Method for manufacturing BGA package using Organic Solderability Preservatives
摘要
申请公布号	KR100547352(B1)	申请公布日期	2006.01.26
申请号	KR20040052227	申请日期	2004.07.06
申请人		发明人
分类号	H01L21/60	主分类号	H01L21/60
代理机构		代理人
主权项
地址

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