| 发明名称 |
Epoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using the same |
| 摘要 |
<p>An epoxy resin composition for encapsulating an optical semiconductor element, which has small internal stress and also can obtain good light transmittance within a broad temperature range. An epoxy resin composition for encapsulating an optical semiconductor element comprising the following component (A):
<UnorderedLists id="ula01" listStyle="none" compact="compact"><ListItem>(A) an epoxy resin complex which comprises an epoxy resin as the matrix component and silicon dioxide particles (a) dispersed therein:
<UnorderedLists id="ula02" listStyle="none" compact="compact"><ListItem>(a) silicon dioxide particles having an average particle size of from 5 to 40 nm measured by the small angle neutron scattering (SANS).</ListItem></UnorderedLists></ListItem></UnorderedLists></p> |
| 申请公布号 |
EP1529807(A3) |
申请公布日期 |
2006.01.25 |
| 申请号 |
EP20040024663 |
申请日期 |
2004.10.15 |
| 申请人 |
NITTO DENKO CORPORATION |
发明人 |
ITO, HISATAKA;OTA, SHINYA |
| 分类号 |
C08L63/00;C08K3/36;C09D7/12;H01L23/00;H01L23/29;H01L33/00 |
主分类号 |
C08L63/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
