发明名称
摘要 PROBLEM TO BE SOLVED: To enable actual manufacture of an active matrix substrate by eliminating the inconvenience in manufacturing which comes into problems in forming the active matrix substrate by using novel transferring technology of thin-film devices. SOLUTION: The active matrix substrate having TFTs (Thin-Film Transistors) and pixel electrodes connected to the TFTs on a substrate includes adhesive layers (1800) formed on the substrate (1900), the TFTs bonded to the substrates by the adhesive layers, the pixel electrodes (1700) connected to the TFTs, and insulating layers (1600) formed on the TFTs. The insulating layers (1600) have apertures (1610) in the positions where the TFTs are not formed. The pixel electrodes (1700) are exposed (1702) in the apertures (1610). COPYRIGHT: (C)2004,JPO
申请公布号 JP3738850(B2) 申请公布日期 2006.01.25
申请号 JP20030424183 申请日期 2003.12.22
申请人 发明人
分类号 G02F1/1333;G02F1/1368;G09F9/30;H01L21/02;H01L21/336;H01L27/12;H01L29/786 主分类号 G02F1/1333
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