| 摘要 |
A Radio Frequency (RF) device includes a semi conductive die and a package in which the semi conductive die mounts. The semi conductive die includes a first portion of an RF circuit and a plurality of bond pads (1310) formed thereon. The package includes a heat slug upon which the semi conductive die (1301) resides, a plurality of package pins (1308), a plurality of bond wires (1306), a downbond rail (1302), and a plurality of bond wire inductors (1304). Each of the bond wires (1306) couples between a corresponding bond pad (1310) and a corresponding package pin (1306). The downbond rail (1302) couples to the heat slug. At least one bond wire inductor (1302) couples between a bond pad (1310) corresponding to the first portion of the RF circuit (1422) and a respective location on the downbond rail, serves as an inductor for a second portion of the RF circuit, may include a plurality of bond wire inductors (1304) coupled in parallel, and has a length and/or a diameter selected to provide a desired inductance. |
