| 摘要 |
<p>PURPOSE: A contact part of a semiconductor device is provided to increase a contact area of a wire and a metal interconnection and improve cohesion of a metal sidewall and lead by forming the metal sidewall on the side surface of a contact hole when the metal interconnection is connected to the wire through the contact hole. CONSTITUTION: A pad is electrically connected to the outside and the semiconductor device formed on a substrate(100). The substrate is covered with an insulation layer having a contact hole(114) exposing the pad. A metal layer is formed on the inner wall of the contact hole. The sidewall of the insulation layer is covered with the metal layer.</p> |
