发明名称 |
Stress reduction in flip-chip PBGA packaging by utilizing segmented chips and/or chip carriers |
摘要 |
A method and structure to electrically couple a semiconductor device to a substrate that is divided into a plurality of segments. Alternatively, a semiconductor device may be divided into a plurality of segments and the plurality of segments are electrically coupled to a single substrate.
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申请公布号 |
US6989607(B2) |
申请公布日期 |
2006.01.24 |
申请号 |
US20030629469 |
申请日期 |
2003.07.29 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
DARBHA KRISHNA;JIMAREZ MIGUEL A.;REISS MATTHEW M.;SATHE SANJEEV B.;WOYCHIK CHARLES G. |
分类号 |
H01L23/12;H01L23/48;H01L23/498;H01L23/52;H01L29/40 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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