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发明名称
The Setting up construction of Semi-conductor Package on PCB
摘要
申请公布号
KR100544967(B1)
申请公布日期
2006.01.24
申请号
KR20030065861
申请日期
2003.09.23
申请人
发明人
分类号
H01L23/10
主分类号
H01L23/10
代理机构
代理人
主权项
地址
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