发明名称 |
Copper foil for printed-wiring board and copper-clad laminate using copper foil for printed-wiring board |
摘要 |
The object is to provide a copper foil excellent in the property of selective etching between a resistor layer and a copper layer required in production of a printed-wiring board, and also excellent in UL heat resistance. For this purpose, a copper foil for printed-wiring board comprising a nodular treatment side on one side, wherein a nickel-zinc alloy layer is formed on the nodular treatment side is used for applications of printed-wiring boards. At the same time, a production method suitable for production of the copper foil is provided.
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申请公布号 |
US6989199(B2) |
申请公布日期 |
2006.01.24 |
申请号 |
US20030415143 |
申请日期 |
2003.04.25 |
申请人 |
MITSUI MINING & SMELTING CO., LTD. |
发明人 |
YAMAMOTO TAKUYA;TAKAHASHI MASARU;YAMADA MASAMICHI |
分类号 |
B32B15/20;B32B15/08;C25D3/56;C25D7/06;H05K1/09;H05K3/00;H05K3/02;H05K3/38;H05K3/46 |
主分类号 |
B32B15/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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