| 摘要 |
An integrated circuit ( 27, 67 ) is packaged by mounting it onto a substrate ( 11, 55 ) with a heat conductive plate ( 1, 41 ) interposed between the integrated circuit ( 27, 67 ) and the substrate ( 11, 55 ). The plate ( 1, 41 ) has portions ( 5, 7, 9 ) extending laterally out from under the integrated circuit, and these portions conduct away heat generated by the integrated circuit ( 27, 67 ). The plate ( 1, 41 ) may be connected to ground, and be connected by wire bonding to pads of the integrated circuit ( 27, 67 ) which are to be grounded. In one arrangement, the plate ( 1 ) may be located above a second integrated circuit such as a flipchip ( 22 ). In another arrangement, a plurality of integrated circuits ( 67 ) may be connected to the substrate ( 55 ) via the plate ( 41 ), and the substrate ( 55 ) and plate ( 41 ) singulated together to form a plurality of packages.
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