| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent the separation of a film, such as an interlayer insulating film, and to improve bonding properties. <P>SOLUTION: A semiconductor integrated circuit device comprises a plurality of wires formed in the interlayer insulating film laminated on a semiconductor substrate; a via for connecting the plurality of wires in the upper and lower directions; a bonding pad that is connected to at least one of the plurality of wires and has a bonding area for connecting a bonding wire for electrical connection to the outside; a plurality of reinforcing patterns that are formed in the interlayer insulating film at the lower section of the bonding pad and are not electrically connected to the bonding pad; and a via for reinforcement for connecting the reinforcement patterns arranged vertically in the plurality of reinforcement patterns. The reinforcement pattern is made of the same member as the plurality of wires, and at least one portion of the member directly below the bonding area has a part in which no member exist. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
