发明名称 LASER BEAM MACHINING APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To obtain a laser beam machining apparatus capable of conducting on-the-spot measuring to enhance production efficiency with high accuracy of quality assurance. <P>SOLUTION: The vicinity of an irradiation spot on a work 3, which spot is irradiated with a machining laser beam 1, is irradiated with a measuring laser beam through a measuring irradiation optical system from a direction approximately parallel to the surface of the work 3. The irradiation of the measuring laser beam is applied with a time delay to give a delay to the measuring laser beam with respect to the machining laser beam 1. Interference fringes between the measuring laser beam that is modulated by a change 4a of the shape of an reaction field in the vicinity of the surface of the work 3 caused by the machining laser beam 1 and a reference beam are generated by an interference optical system. Further, the image of the interference fringes generated by the interference optical system is picked up with an image pickup device, and data of the reaction field 4b in the vicinity of the surface of the work 3 in the middle of machining are calculated from a phase of the interference fringes with a computer. Based on this procedure, the reaction field data, which are obtained by the on-the-spot measuring in the middle of machining, are compared with a data base, where the correlation, obtained previously, between the reaction field data obtained by the laser beam machining apparatus and the machining quality data of the work, is stored. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2006015373(A) 申请公布日期 2006.01.19
申请号 JP20040196024 申请日期 2004.07.01
申请人 RICOH CO LTD 发明人 MORITA NOBUHIRO;YAMADA YASUSHI;SEO MANABU
分类号 B23K26/00;G01B11/24;H01S3/00 主分类号 B23K26/00
代理机构 代理人
主权项
地址