| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component and an electronic device wherein failure due to disconnection is not caused even if crack is generated in a constrictive portion of solder bump, so that teardown of the solder bump can be prevented. SOLUTION: In the electronic component, a first substrate 10 and a second substrate 30 are arranged in face to face with each other, and the solder bumps 13 are individually arranged between a plurality of first conductor portions 11a arranged on one surface side having electric insulation of the first substrate 10 and a plurality of second conductor portions 32 arranged on one surface side having electric insulation of the second substrate 30. The electronic component has texture wherein at least one solder bump 13 has a heterogeneous frame 14a with the solder bump in the interior, and the gap 14b' of the frame is filled with solder which makes the solder bump. COPYRIGHT: (C)2006,JPO&NCIPI
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