| 摘要 |
PROBLEM TO BE SOLVED: To accurately fix positioning of a printed circuit board relative to a mold base while effectively utilizing solder self-alignment effect in reflow without complicating a structure of the mold base and increasing costs. SOLUTION: In an electronic component comprising a mold base 2 which includes a recessed portion 4 on its upper surface and further comprising a connecting pad 6 on an upper surface of an outer frame 5, and a printed circuit board 10 mounting circuit components 15 on both upper and lower surfaces, respectively, placing at least one circuit component 15a mounted on the lower surface on the outer surface of the outer frame while fitting into the recessed portion 4 of the mold base and further including a connecting pad 13 on its lower surface, at least one positioning recess 7 is formed on the upper surface of the outer frame of the mold base, a positioning member 16 fitted into the positioning recess is provided on the lower surface of the printed circuit board and by fitting the positioning member into the positioning recess, positioning of the printed circuit board relative to the mold base is performed. COPYRIGHT: (C)2006,JPO&NCIPI
|
