| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive coating using a cheap copper powder, having good conductivity and excellent adhesion and causing little conductivity shift in high humidity conditions, and to provide electronic devices using the coating. SOLUTION: The conductive coating comprises a flaky or dendritic copper powder or silver-plated copper powder which powder has≤30μm average diameter, a polymer or copolymer of a vinyl compound, an amino resin, 0.001-5.0 wt.% silane coupling agent based on the solid component of the coating composition, and an organic solvent. The electronic devices using the coating are provided. COPYRIGHT: (C)2006,JPO&NCIPI
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