发明名称 APPARATUS FOR PROCESSING SUBSTRATE SURFACE
摘要 PROBLEM TO BE SOLVED: To provide an apparatus for processing a substrate, capable of effectively suppressing an inverse scattering and a particle contamination of treating liquid at the working time of a coating, a cleaning or the like of a substrate to be processed. SOLUTION: The apparatus for processing substrate surface comprises a spin chuck which chucks and maintains a substrate, and drives the substrate in rotation and rise/fall; upper/lower portions bowls which cover around the spin chuck and receive a supply of treating liquid for processing the substrate surface with an upper portion; an evacuation port for evacuating an internal air of whole bowl, from the portion of the lower portion bowl; and a flow separating projection which is arranged inside the upper portion bowl and exhausts a flow separated to the lower portion through the exhaust port, by separating the flow around the substrate in the perpendicular direction. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006019734(A) 申请公布日期 2006.01.19
申请号 JP20050188777 申请日期 2005.06.28
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 KIM TAE-GYU;PARK TAE-SANG
分类号 H01L21/304;B05C11/02;B05C11/08;B05C13/00;H01L21/00;H01L21/027;H01L21/687 主分类号 H01L21/304
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