| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit module having interlayer mounting components as well as its incidental circuit bodies and contriving the improvement of electric characteristics together with miniaturization and thinning, and to provide its manufacturing method. SOLUTION: The interlayer mounting components 100 and a thin film laminated circuit 4 constituting the incidental circuit unit of the interlayer mounting component 100 are mounted on a base substrate 5 while these interlayer mounting components 100 and the thin film laminated circuit 4 are sealed in the hollow part 103 of a sealing material layer 102. COPYRIGHT: (C)2006,JPO&NCIPI
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