发明名称 |
STRUCTURED RESIN SYSTEMS WITH HIGH THERMAL CONDUCTIVITY FILLERS |
摘要 |
<p>In one embodiment the present invention provides for a high thermal conductivity highly structured resin that comprises a host highly structured resin matrix, and a high thermal conductivity filler 30. The high thermal conductivity fillers are from 1-1000 nm in length, and high thermal conductivity fillers have an aspect ratio of between 3-100. Particular highly structured highly structured resins include at least one of liquid crystal 40 polymers, interpenetrating networks, dendrimer type matrices, expanding polymers, ladder polymers, star polymers and structured organic-inorganic hybrids 60.</p> |
申请公布号 |
WO2006007385(A1) |
申请公布日期 |
2006.01.19 |
申请号 |
WO2005US21218 |
申请日期 |
2005.06.15 |
申请人 |
SIEMENS POWER GENERATION, INC.;SMITH, JAMES DAVID BLACKHALL;STEPHENS, GARY;WOOD, JOHN WILLIAM |
发明人 |
SMITH, JAMES DAVID BLACKHALL;STEPHENS, GARY;WOOD, JOHN WILLIAM |
分类号 |
H01B3/00;C08K3/00;C08K3/14;C08K3/22;C08K3/28;C08K7/00;C08K9/04;C08L63/00;C08L101/00 |
主分类号 |
H01B3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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