发明名称 PROCESS FOR CONTROLLING PROXIMITY EFFECT CORRECTION
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for correcting the irradiation parameters in an electron beam lithography system surely by taking the impact of fogging effect into account. <P>SOLUTION: The process for controlling proximity effect correction in an electron beam lithography system comprises a first step where an arbitrary set pattern is exposed without applying a process for controlling proximity correction. Geometrical arrangement of an obtained test structure is measured and a set of measurement data is obtained. In a numerical range, basic input parameters of &alpha;, &beta; and &eta; are obtained from the set of measurement data. A model is fitted to the measurement data set by varying at least the basic input parameters &alpha;, &beta; and &eta; of a control function and an optimal set of parameters is obtained. A correction function is applied to exposure control of the electron beam lithography system during exposure of a pattern according to design data. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006019733(A) 申请公布日期 2006.01.19
申请号 JP20050188343 申请日期 2005.06.28
申请人 LEICA MICROSYSTEMS LITHOGRAPHY GMBH 发明人 HUDEK PETER;BEYER DIRK
分类号 H01L21/027;G03C5/00;G03F1/00;G03F7/20;H01J37/317 主分类号 H01L21/027
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