发明名称 PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To carry out transportation, etc. smoothly without any influence by an adhesive tape waste even if the adhesive tape waste attaches to a frame F by processing a wafer integrated together with the frame F via an adhesive tape T. SOLUTION: A delivery means 11 for delivering a wafer W at the time of carrying the wafer W in and out of a processing apparatus is provided with a first L-shaped rail 110 consisting of a first bottom face supporter 112, and a first side supporter 113; and a second L-shaped rail 111 which consists of a second bottom face supporter 114 and a second side part supporter 115, and is so arranged as to face the first L-shaped rail 110. Above the first bottom face supporter 112 and the second bottom face supporter 114, a first draw-out restrictor 116 and a second draw-out restrictor 117, both for restricting the movement of the frame carried out of a wafer cassette, are so arranged as to face each other. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006019354(A) 申请公布日期 2006.01.19
申请号 JP20040193239 申请日期 2004.06.30
申请人 DISCO ABRASIVE SYST LTD 发明人 YOSHIDA KEIGO;HIGAKI TAKEHIKO
分类号 H01L21/677;H01L21/301 主分类号 H01L21/677
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