发明名称 |
Method of removing lead-free solder from slider pad and magnetic disk drive |
摘要 |
A method for removing a lead-free solder from a slider pad is provided to permit re-utilization of a head/slider used in a magnetic disk drive. In one embodiment, a slider pad formed on a head/slider and a lead pad are connected to each other through a lead-free solder fillet. A cutting tool is heated beforehand to a temperature near the melting point of the lead-free solder. The cutting tool is moved in parallel with a surface of the slider pad to cut the solder fillet while softening the solder fillet. The solder fillet is removed so as not to impose a stress on the slider pad and in a state in which the head/slider can be re-utilized.
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申请公布号 |
US2006012918(A1) |
申请公布日期 |
2006.01.19 |
申请号 |
US20050179219 |
申请日期 |
2005.07.11 |
申请人 |
HITACHI GLOBAL STORAGE TECHNOLOGIES NETHERLANDS B.V. |
发明人 |
HASHI NOBUYUKI;MATSUMOTO YUHSUKE;SATOH TAKUYA;YOSHIDA TATSUSHI |
分类号 |
G11B5/60 |
主分类号 |
G11B5/60 |
代理机构 |
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主权项 |
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地址 |
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