Circuit device with at least partial packaging and method for forming

摘要

A circuit device ( 15 ) is placed within an opening of a conductive layer ( 10 ) which is then partially encapsulated with an encapsulant ( 24 ) so that the active surface of the circuit device ( 15 ) is coplanar with the conductive layer ( 10 ). At least a portion of the conductive layer ( 10 ) may be used as a reference voltage plane (e.g. a ground plane). Additionally, a circuit device ( 115 ) may be placed on a conductive layer ( 100 ) such that an active surface of circuit device ( 115 ) is between conductive layer ( 100 ) and an opposite surface of circuit device ( 115 ). The conductive layer ( 100 ) has at least one opening ( 128 ) to expose the active surface of circuit device ( 115 ). The encapsulant ( 24, 126, 326 ) may be electrically conductive or electrically non-conductive.