发明名称 |
Verfahren zur Herstellung eines Verbundes aus einer getesteten integrierten Schaltung und einer elektrischen Einrichtung |
摘要 |
Integrated circuit comprises an elastically deformable protrusion (11) on a switching substrate (10), a contact unit (13) arranged on the protrusion for producing an electrical connection, and a rewiring unit (12, 14, 15) for electrically connecting an active semiconductor section of the integrated circuit to the contact unit. The rewiring unit is formed as a ring around the protrusion at the foot of the protrusion and in electrical connection with the contact unit. An Independent claim is also included for a process for the production of a composite made from a tested integrated circuit and an electrical unit. |
申请公布号 |
DE10238582(B4) |
申请公布日期 |
2006.01.19 |
申请号 |
DE2002138582 |
申请日期 |
2002.08.22 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
HEDLER, HARRY;MEYER, THORSTEN |
分类号 |
H01L21/60;H01L21/66;H01L23/485;H01L23/498;H01L23/50 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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