发明名称 Verfahren zur Herstellung eines Verbundes aus einer getesteten integrierten Schaltung und einer elektrischen Einrichtung
摘要 Integrated circuit comprises an elastically deformable protrusion (11) on a switching substrate (10), a contact unit (13) arranged on the protrusion for producing an electrical connection, and a rewiring unit (12, 14, 15) for electrically connecting an active semiconductor section of the integrated circuit to the contact unit. The rewiring unit is formed as a ring around the protrusion at the foot of the protrusion and in electrical connection with the contact unit. An Independent claim is also included for a process for the production of a composite made from a tested integrated circuit and an electrical unit.
申请公布号 DE10238582(B4) 申请公布日期 2006.01.19
申请号 DE2002138582 申请日期 2002.08.22
申请人 INFINEON TECHNOLOGIES AG 发明人 HEDLER, HARRY;MEYER, THORSTEN
分类号 H01L21/60;H01L21/66;H01L23/485;H01L23/498;H01L23/50 主分类号 H01L21/60
代理机构 代理人
主权项
地址