| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic parts mounting device and an electronic parts mounting method for establishing prevention of mounting failures due to the position deviation of printed solder and the improvement of productivity. <P>SOLUTION: This method for mounting electronic parts for mounting electronic parts on a substrate after solder printing, and for carrying out solder bonding is provided to calculate a parameter for electrode position correction calculation, by recognizing a recognition mark as a substrate featured point, to calculate a parameter for solder print position correction calculation by recognizing the position of solder printed on a dummy electrode as a solder featured point representing solder print position deviation tendency in the substrate as a whole, to calculate the electrode position and solder print position of the target of mounting by those parameters for correction calculation, and to calculate a part mounting position from the calculated electrode position and solder print position. Thus, efficient calculation of the solder print position of each electrode can be made, without calculating the solder print position. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
