| 摘要 |
PROBLEM TO BE SOLVED: To satisfy a demand of a manufacturing method of a semiconductor device with high joining reliability with low stress at the time of flip chip connection between a semiconductor chip and a circuit board by preventing a short-circuit between bumps by a simple method, as pitches become minute between bumps of the semiconductor chip of a semiconductor device for high frequency. SOLUTION: The manufacturing method of a semiconductor device which carries out face-down mounting a semiconductor device with a plurality of projection metal electrodes at a circuit board comprises a process for making the parietal region of the projection metal electrode even and smooth, a process for covering at least the whole surface of the projection metal electrode with a solidified insulating layer, a process for carrying out the opposite arrangement of the projection metal electrode of the semiconductor device and an electrode terminal formed on the circuit board, and a process for impressing a load to a semiconductor device and joining the projection metal electrode and the electrode terminal of the circuit board. COPYRIGHT: (C)2006,JPO&NCIPI
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