| 发明名称 |
Chip package used as a ball grid array package comprises a reinforcing layer fixed to a system carrier |
| 摘要 |
<p>Chip package comprises a reinforcing layer (2) fixed to a system carrier (1). The reinforcing layer has openings (3) for the chip, in which the openings are as large as the dimensions of the chips. Each chip is surrounded by a reinforced frame and is embedded in the cavity produced.</p> |
| 申请公布号 |
DE102004029585(A1) |
申请公布日期 |
2006.01.19 |
| 申请号 |
DE20041029585 |
申请日期 |
2004.06.18 |
| 申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
REIS, MARTIN;NOCKE, KERSTIN;BENDER, CARSTEN;KROEHNERT, STEFFEN |
| 分类号 |
H01L21/48;H01L23/053;H01L23/12 |
主分类号 |
H01L21/48 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
