| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve manufacturing efficiency, when thin-film integrated circuits are sealed. <P>SOLUTION: The device has a first roller around which a first substrate is wound, a second roller around which a second substrate is wound, a third roller, a fourth roller and a fifth roller. The first substrate is supplied to the third roller by making the first roller rotate. Further, the second substrate is supplied to the fifth roller by making the second roller rotate. Further, one surface of at least one thin-film integrated circuit on the third substrate is contacted with the first substrate by making the third roller rotate. Further, the other surface of the thin-film integrated circuit is contacted with the second substrate by making the fourth and fifth rollers rotate, and the thin film integrated circuit is sealed with the first and second substrates, by performing either one or both of pressurization treatment and heat treatment on the first substrate, the second substrate and the thin film integrated circuit, when the thin-film integrated circuit passes through between the fourth roller and the fifth roller. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
