| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat sink which is used for dissipating heat released from a heating element, such as a semiconductor light emitting device, a semiconductor light receiving element, a semiconductor device or the like, and to provide a semiconductor apparatus equipped with the same. <P>SOLUTION: The heat sink is equipped with a laminated member composed of a first plate-like member having a first surface thermally connected to the heating element, a second plate-like member connected to the second surface of the first plate-like member, a feed opening which is provided to the laminated member and through which fluid is supplied, and a discharge opening which communicates with the feed opening and through which the fluid is discharged. The second surface of the first plate-like member is roughened, and irregularities are provided to the second surface of the first member, facing the connection region of the heating element. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
