| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To obtain a semiconductor package excellent in airtightness, moisture resistance and chemical resistance. <P>SOLUTION: The semiconductor package consists of a first substrate at least, including a semiconductor base, a functional element provided on one of surfaces of the semiconductor base, a pad electrically connected with the functional element via a first wire, and a through electrode filled with a first conductor via an insulation film A in a fine pore electrically connected with the pad and extending from one of the surfaces of the semiconductor base to the other; and a second substrate joined with one of the surfaces of the first substrate through the use of a sealant provided around the functional element. The insulation film A is formed to couple with an insulation film B provided on the other surface of the semiconductor base, an insulation film C provided on the external side face of the semiconductor base, and an insulation film D provided on the external side face of the sealant. The exterior of the insulation film is, more preferably, covered doubly with a conductor. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
