CONDUCTIVE MATERIAL, CONDUCTIVE PASTE, AND SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a conductive material and conductive paste for a conductive circuit which are used for forming the conductive circuit with high density on a printed wiring board, of which the electric resistances are lower than that of conventional conductive material which has a higher melting point than a heat-resistant temperature of an insulating board of the printed wiring board and can resist a soldering temperature for an electronic part. SOLUTION: This conductive material has conductivity and is provided with a film of a second metal film having a melting point lower than that of a first metal and being able to form an inter-metallic compound with the first metal on surfaces of particles of the first metal to become nucleus, and has a melting point of the inter-metallic compound between the first metal and the second metal which is formed by being melt at a temperature lower than the heat-resistant temperature of the insulating board of the printed wiring board to be higher than a melting point of soldering in mounting the electronic part on the printed wiring board. COPYRIGHT: (C)2006,JPO&NCIPI