发明名称 THIN-FILM-FORMING APPARATUS AND THIN-FILM-FORMING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a thin-film-forming apparatus for reproducibly and stably forming a functional thin-film on a wide and long film-shaped substrate so as to give a uniform film thickness in the width direction as well as the length direction, and to provide a thin-film-forming method therefor. SOLUTION: The thin-film-forming method for forming the thin film by heating and evaporating a thin-film-forming material arranged so as to face a continuously supplied film-shaped substrate, in a vacuumized space, and depositing the evaporated material on the substrate comprises: employing a sublimable material for the thin-film-forming material; arranging it in a plurality of different positions in the width direction of the substrate, each of which is distant from the surface of the substrate by the distance of 1.5 times or longer of the width dimension in the width direction which is vertical to the direction of supplying the substrate; and heating each of the sublimable materials arranged there with a resistive heating method; and forming the thin film on the supplied substrate while evaporating the sublimable material. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006016628(A) 申请公布日期 2006.01.19
申请号 JP20040192472 申请日期 2004.06.30
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 KUNIEDA TOSHIAKI
分类号 C23C14/24;G11B5/85;G11B7/26 主分类号 C23C14/24
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