| 摘要 |
An apparatus is provided to improve clamping of a work piece to a support surface. The apparatus includes a support base, an insulator layer disposed on the support base, an electrode layer disposed on the insulator layer, and a clamping layer comprising aluminum oxynitride disposed on the electrode layer wherein the workpiece is clamped to the surface of the clamping layer. The apparatus provides a higher clamping force for the workpiece while reducing gas leakage and particle levels in addition to maintaining a declamping time suitable for high throughput processing. The apparatus may also include a support base, an insulator layer disposed on the support base, an electrode layer disposed on the insulator layer, and a clamping layer comprising a dielectric layer and a resilient material layer disposed on the electrode layer wherein the workpiece is clamped to the surface of the clamping layer. The apparatus and configurations of the dielectric and resilient layers further reduce backside particle generation while providing a high clamping force for the workpiece.
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