EPOXY RESIN MOLDING MATERIAL FOR SEALING AND ELECTRONIC COMPONENT DEVICE

摘要

An epoxy resin molding material for sealing includes (A) an epoxy resin, (B) a curing agent and (C) magnesium hydroxide, and the magnesium hydroxide is coated with silica. Thus, the non-halogen and non-antimony epoxy resin molding material suitable for VLSI sealing, which has high reliabilities in flame resistance, moldability, reflow resistance, moisture resistance and high-temperature shelf test, and an electronic component device provided with an element sealed with the molding material are provided.