| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor element mounting structure etc., that can make the drawing around of wiring patterns easier and can reduce the size of a substrate. SOLUTION: In the semiconductor element mounting structure, a semiconductor element provided with a group of bump electrodes to be face-down bonded to the substrate and the wiring pattern formed on the substrate are electrically connected to each other. The group of bump electrodes contains a first bump electrode row arranged along one side of the semiconductor element, and a second bump electrode row which is substantially linearly in-plane arranged at a prescribed distance from the facing one side of the semiconductor element. On the substrate, the first wiring pattern corresponding to the first bump electrode row and the second wiring pattern corresponding to the second bump electrode row are respectively formed. When the structure is viewed in the vertical direction, in addition, the first wiring patterns is formed in a state where the pattern is drawn out so that the pattern may intersect the one side of the semiconductor element and, at the same time, the second wiring pattern is formed in a state where the pattern is drawn out so that the pattern may intersect a plurality of sides of the element except the one side. COPYRIGHT: (C)2006,JPO&NCIPI |
