发明名称 |
Use of direct gold surface finish on a copper wire-bond substrate, methods of making same, and methods of testing same |
摘要 |
A wire-bonding substrate is described. The wire-bonding substrate includes a copper metallization and a gold surface finish disposed above and on the copper metallization. The gold surface finish completes a structure that includes at least one of a bond finger for wire bonding of a first side of the substrate, and a land pad for a ball attach on a second side of the substrate. A process of forming the surface finish is also disclosed. An electronic package is also disclosed that uses the surface finish on the wire-bonding substrate. A method of assembling an electronic package is also disclosed that includes the surface finish on the wire-bonding substrate. A computing system is also described that includes the surface finish on the wire-bonding substrate.
|
申请公布号 |
US2006012042(A1) |
申请公布日期 |
2006.01.19 |
申请号 |
US20050230858 |
申请日期 |
2005.09.20 |
申请人 |
INTEL CORPORATION |
发明人 |
TAGGERT BRIAN;HACKITT DALE;MISRA DILIP K. |
分类号 |
H01L23/48;C23C28/02;C23C30/00;H01L21/66;H01L23/498;H05K3/24;H05K3/34 |
主分类号 |
H01L23/48 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|